ELSPES ultra-high-density silicon capacitors have been developed with high-k dielectrics and low-resistivity electrodes using semiconductor processes, employing a deep trench 3D structure to achieve a smaller size and higher capacitance. ELSPES's technology offers a range of form factors, providing high capacitance levels up to 1,000 nF/mm² (with 2,000 nF/mm² under development).
Currently, products with a silicon thickness of 70 μm are in the production stage (50 μm available on request). Reliable dielectric and electrode performance, as well as capacitance and electrical characteristics, are optimized through silicon processes.
Customizable multi-terminals contribute to the high performance (low ESR and low ESL) of the silicon capacitor in various designs. ELSPES silicon capacitors feature stability in the face of temperature and voltage changes, ensuring reliability over a 10-year lifespan (TDDB).