We are pleased to announce that ELSPES will be participating in PwrSoC 2025 (Power Supply on Chip) under the section of Integrated Capacitors and Energy Storage. At this global conference, ELSPES will present its deep trench silicon capacitor (ED04), optimized for next-generation power delivery applications.

ED04, featuring ultra-low ESL (< 1 pH) and ESR (< 3 mΩ) with a breakdown voltage > 4 V, offers a compelling solution for high-performance decoupling in advanced packages. With a capacitance density of ~2,500 nF/mm² in a compact form factor (1.26 × 1.03 mm²), ED04 enables space-saving and performance-boosting strategies in flip-chip and embedded configurations.

The presentation will also briefly touch on coupling capacitor integration and the evolving needs of power integrity in dense SoC environments. Backed by proven reliability data and long operational lifetime (up to 27,000 years @150 °C), ED04 is being recognized as a transformative passive device solution.

This participation not only demonstrates our technology but also reflects growing interest from leading industry players. We look forward to engaging with global partners and showcasing our contributions to next-generation power systems.

September 24-26, 2025

    Seoul National University, Seoul, Korea